Wafer cleaning apparatus and wafer cleaning system including the same

Abstract

A wafer cleaning apparatus and a semiconductor manufacturing process are provided. The wafer cleaning apparatus comprising a plate extending in a first direction, a connecting part which is directly connected to the plate, and extends in a second direction intersecting the first direction, a connecting serrated part which protrudes from the connecting part in the first direction, and is spaced apart from the plate in the second direction and a boundary connecting serrated part which protrudes from the connecting part in the first direction, and is directly connected to the plate, wherein the plate includes a guide part having a shape of a circle that is cut along an upper chord and a lower chord spaced apart in the first direction among chords of a circle, a holder connecting part extending from the upper chord in the first direction, and a support part extending from the lower chord in the first direction, the connecting serrated part includes a first connecting serrated part adjacent to the boundary connecting serrated part, and a second connecting serrated part adjacent to the first connecting serrated part, the first connecting serrated part is disposed between the boundary connecting serrated part and the second connecting serrated part, the connecting serrated part and the connecting part are directly connected to each other with the lower surface of the connecting serrated part as a boundary, and a distance of the lower surface of the connecting serrated part in the second direction is constant, a spaced distance in the second direction between a first point at which the boundary connecting serrated part and the first connecting serrated part are directly connected and a second point at which the first connecting serrated part and the second connecting serrated part are directly connected is defined as a distance of the lower surface of the first connecting serrated part in the second direction, and a distance of the lower surface of the first connecting serrated part in the second direction is equal to a spaced distance between the first point and the plate in the second direction.