The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jun. 12, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tsunenaga Nakashima, Koshi City, JP;

Hiroaki Inadomi, Koshi City, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10P 50/24 (2026.01); H10P 70/00 (2026.01); H10P 72/30 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0456 (2026.01); H10P 50/242 (2026.01); H10P 70/80 (2026.01); H10P 72/0408 (2026.01); H10P 72/0421 (2026.01); H10P 72/0458 (2026.01); H10P 72/0466 (2026.01); H10P 72/3218 (2026.01); H10P 72/3306 (2026.01); H10P 72/3312 (2026.01);
Abstract

A substrate processing apparatus includes a liquid processing apparatus configured to form a liquid film on a surface of a substrate; a supercritical drying apparatus configured to dry the substrate by replacing the liquid film with a supercritical fluid; a first load-lock apparatus configured to switch an atmosphere around the substrate from a first one of a normal pressure atmosphere and a decompressed pressure atmosphere to a second one thereof on a transfer path of the substrate; a dry-cleaning apparatus configured to dry-clean the surface of the substrate under a decompressed pressure; and a control device configured to perform forming of the liquid film by the liquid processing apparatus, drying of the substrate by the supercritical drying apparatus, switching of the atmosphere around the substrate by the first load-lock apparatus, and dry-cleaning of the substrate by the dry-cleaning apparatus in this order.


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Nakashima, Tsunenaga. (2026). Substrate processing apparatus and substrate processing method (U.S. Patent No. 12777878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777878

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