The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Dec. 27, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuta Nakane, Kurokawa-gun, JP;

Sho Kumakura, Kurokawa-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/20 (2026.01); H10P 50/00 (2026.01); H10P 50/26 (2026.01); H10P 76/40 (2026.01);
U.S. Cl.
CPC ...
H10P 50/71 (2026.01); H10P 50/267 (2026.01); H10P 76/4085 (2026.01);
Abstract

In one exemplary embodiment, a substrate processing method includes: (a) providing a substrate including a metal-containing film and a mask provided on the metal-containing film; (b) forming a protective film on the mask; and (c) etching the metal-containing film after (b). (c) includes (c1) forming a second metal-containing substance from a first metal-containing substance contained in the metal-containing film by using a first processing gas including a fluorine-containing gas, and (c2) removing the second metal-containing substance by using a second processing gas including a precursor.


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Nakane, Yuta. (2026). Substrate processing method and substrate processing apparatus (U.S. Patent No. 12777862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777862

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