The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Aug. 26, 2022
Applicant:

Honor Device Co., Ltd., Shenzhen, CN;

Inventors:

Guochao Fu, Shenzhen, CN;

Yuanru Yang, Shenzhen, CN;

Assignee:

HONOR DEVICE CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H10K 59/80 (2023.01); H10K 59/95 (2023.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); H05K 7/20963 (2013.01); H10K 59/87 (2023.02); H10K 59/8794 (2023.02); H10K 59/95 (2023.02);
Abstract

An electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer component has a recess, and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess.


Find Patent Forward Citations

Quick Actions:

Fu, Guochao. (2026). Electronic device comprising recess in buffer component for removing heat generated by electronic components (U.S. Patent No. 12777621). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777621

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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