The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Jun. 29, 2023
Applicant:
Ennostar Corporation, Hsinchu City, TW;
Inventors:
Assignee:
ENNOSTAR CORPORATION, Hsinchu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0232 (2021.01); H01S 5/02253 (2021.01); H01S 5/024 (2006.01); H01S 5/028 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0232 (2021.01); H01S 5/02253 (2021.01); H01S 5/02469 (2013.01); H01S 5/0283 (2013.01); H01S 5/183 (2013.01);
Abstract
A package structure is provided. The package structure includes a substrate, a frame structure, and a lens portion. The frame structure is disposed on the substrate. A sidewall of the frame structure has multiple lamination traces thereon. The lens portion covers the substrate. The frame structure has a through hole passing through the sidewall, and the through hole includes an edge, and a portion of the lamination traces overlaps the edge of the through hole.
Kuo, Meng. (2026). Package structure (U.S. Patent No. 12776618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776618
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile