The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Apr. 10, 2023
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Masao Kainuma, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/02469 (2013.01);
Abstract
A stem for a semiconductor package includes an eyelet including a flat plate having a first surface and a second surface opposite to the first surface, a cavity opening to the first surface of the flat plate, and a metal block protruding from the second surface of the flat plate, and a lead extending through the flat plate from the first surface to the second surface, wherein a volume of the metal block is substantially the same as a volume of the cavity.
Kainuma, Masao. (2026). Stem for semiconductor package and semiconductor package (U.S. Patent No. 12776617). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12776617
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile