The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jul. 16, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Saideep Tiku, Fort Collins, CO (US);

Poorna Kale, Folsom, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0616 (2013.01); G06F 3/0653 (2013.01); G06F 3/0673 (2013.01);
Abstract

The present disclosure includes apparatuses and methods related to receiving, by a System-on-Chip (SoC) device, a command sequence and predicting a thermal event that likely corresponds to the received command sequence. The command sequence may include an instruction code that can be representative of a mode of operation of a vehicle. In one embodiment, a thermal model may be used to predict the likely thermal event that corresponds to the command sequence. A thermal option may then be implemented to address adverse thermal effects of the predicted thermal event.


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Quick Actions:

Tiku, Saideep. (2026). Proactive resilience to thermal events in a memory device (U.S. Patent No. 12775389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12775389

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