The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

May. 16, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Yu Liao, Hsinchu City, TW;

Tsai-Hao Hung, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/013 (2013.01); B81C 2201/019 (2013.01); B81C 2203/0792 (2013.01);
Abstract

A microdevice including a first pedestal, a second pedestal parallel to the first pedestal, the second pedestal comprising a first protrusion on its top surface. The device also including a conformal dielectric layer and a metal structure formed over a portion of the conformal dielectric layer. The metal structure including a first portion surrounding the first protrusion, a second portion parallel to the top surface of the polysilicon pedestal, and a third portion connecting the first portion and the second portion.


Find Patent Forward Citations

Quick Actions:

Liao, Shih-Yu. (2026). Microelectromechanical device and method for making the same (U.S. Patent No. 12774206). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12774206

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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