Semiconductor structure with chipset including multiple chips, memory, and method of forming same

Abstract

The present disclosure relates to the technical field of semiconductors and provides a semiconductor structure, a method of forming same, and a memory. The method of forming a semiconductor structure of the present disclosure includes: providing a carrier board; forming a chipset on one side of the carrier board, where the chipset includes multiple chips stacked in a direction perpendicular to the carrier board; where among multiple chips, an orthographic projection of a chip closer to the carrier board on the carrier board is within an orthographic projection of a chip farthest from the carrier board on the carrier board; forming an insulating dielectric layer covering the chipset; and performing a grinding process to expose a predetermined surface of the chip farthest from the carrier board outside the insulating dielectric layer.