Semiconductor package structure, fabricating method thereof, and memory system

Abstract

The present disclosure provides a semiconductor package structure, a fabricating method thereof, and a memory system. The fabricating method comprises: providing an initial semiconductor package structure comprising: an initial substrate, a die device on the initial substrate and electrically connected with the initial substrate, and an initial package layer on the initial substrate and covers the die device; removing the initial substrate to obtain a die package device including the die device and at least a portion of the initial package layer; attaching a package substrate on the die device and electrically connecting the die device with the package substrate; and forming a first package layer on the package substrate to cover the die package device.