The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Dec. 14, 2023
United Microelectronics Corp., Hsin-Chu City, TW;
Da-Jun Lin, Kaohsiung City, TW;
Bin-Siang Tsai, Changhua County, TW;
Fu-Yu Tsai, Tainan City, TW;
Tai-Cheng Hou, Tainan City, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Abstract
A semiconductor package includes a RDL interposer having a first surface and a second surface; fanout pads and peripheral pads on the second surface; a first semiconductor die on the first surface and electrically connected to the fanout pads; a molding compound surrounding the first semiconductor die and the first surface of the RDL interposer; through mold vias in the molding compound around the first semiconductor die; peripheral solder bumps within the through mold vias and directly disposed on the peripheral pads; through silicon via pads on the rear surface of the first semiconductor die; a second semiconductor die bonded to the through silicon via pads of the first semiconductor die and the peripheral solder bumps within the through mold vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile