Semiconductor module having heat dissipation base surrounded by elastic member, power converter containing the same, and power converter manufacturing method therefor

Abstract

A semiconductor module includes an insulated circuit substrate including a semiconductor chip, an insulated circuit substrate including a wiring board provided on a front surface thereof, the wiring board having the semiconductor chip bonded thereto, a heat dissipation base having a front surface and a rear surface opposite to each other. The front surface has a substrate region to which the insulated circuit substrate is bonded. The rear surface has a heat dissipation region positioned overlapping the substrate region in a plan view of the semiconductor module and a loop-shaped region surrounding the heat dissipation region. The semiconductor module further includes a solid heat dissipation member made of a phase change material and provided on the rear surface of the heat dissipation base in the heat dissipation region, and an elastic member provided on the rear surface of the heat dissipation base in the loop-shaped region.