The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Dec. 15, 2022
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Zheng Wei Wu, Kaohsiung, TW;
Cheng Kai Chang, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 70/60 (2026.01); H10W 70/63 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 74/014 (2026.01); H10W 74/114 (2026.01); H10W 74/131 (2026.01); H10W 70/611 (2026.01); H10W 70/635 (2026.01); H10W 90/701 (2026.01);
Abstract
The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.
Wu, Zheng. (2026). Semiconductor device package and method of manufacturing the same (U.S. Patent No. 12772855). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772855
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile