The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Sep. 14, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Kisik Choi, Watervliet, NY (US);

Brent A. Anderson, Jericho, VT (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10W 20/20 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10W 20/20 (2026.01); H10W 20/42 (2026.01);
Abstract

A semiconductor device having a source/drain having a height, a length, and a width. A full wrap-around contact surrounds a partial length of the source/drain. The full wrap-around contact includes a frontside recessed wrap-around contact from a front side of the source/drain and a backside conductive contact from a back side of the source/drain.


Find Patent Forward Citations

Xie, Ruilong. (2026). Backside contact with full wrap-around contact (U.S. Patent No. 12772823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772823

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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