The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Sep. 13, 2023
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventor:

Makoto Tsutsue, Yokkaichi, JP;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); C23C 16/458 (2006.01); H10P 14/60 (2026.01); H10P 72/76 (2026.01); H10P 72/78 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7611 (2026.01); C23C 16/4585 (2013.01); C23C 16/4586 (2013.01); H10P 14/6336 (2026.01); H10P 72/78 (2026.01);
Abstract

A method includes placing a wafer on a step of a carrier ring in a first vacuum enclosure such that a backside surface of the wafer contacts the step, depositing a film on an exposed portion of the backside surface of the wafer while the backside surface of the wafer is in contact with the step, and depositing a semiconductor device on a front side of the wafer which is opposite to the backside surface of the wafer. The carrier ring includes a bottom surface surrounding an opening in the carrier ring, an upper top surface, a lower top surface of the step, and an inner surface which connects the upper top surface and the lower top surface, and which is inclined outward at a non-zero taper angle relative to the vertical direction which perpendicular to the lower top surface of the step.


Find Patent Forward Citations

Quick Actions:

Tsutsue, Makoto. (2026). Semiconductor device fabrication method using a deposition apparatus with a contoured wafer carrier ring (U.S. Patent No. 12772796). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772796

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…