The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Mar. 28, 2023
Renesas Electronics Corporation, Tokyo, JP;
Tsuyoshi Kanao, Tokyo, JP;
Koji Ogata, Tokyo, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device includes: a grind step of forming a small thickness portion and a large thickness portion surrounding the small thickness portion in plan view by grinding a back surface of a semiconductor wafer; a preparation step of preparing a wafer holding member including a wafer placement surface and a back surface opposite to the wafer placement surface and having a larger thickness than a difference between a thickness of the large thickness portion and a thickness of the small thickness portion; and a placement step of placing the semiconductor wafer on the wafer holding member so that the small thickness portion of the semiconductor wafer and the wafer placement surface of the wafer holding member are in contact with each other on the back surface side of the semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile