The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Feb. 14, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Miyako Kaneko, Nirasaki City, JP;

Naoko Suzuki, Nirasaki City, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/69 (2026.01); C23C 16/26 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
H10P 14/6902 (2026.01); C23C 16/26 (2013.01); C23C 16/45529 (2013.01); C23C 16/45544 (2013.01); C23C 16/4586 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01);
Abstract

Provided are a substrate processing method and a substrate processing apparatus that improve an etching resistance and suppress a film stress. A substrate processing method of forming a carbon-based film on a substrate includes: a process of placing the substrate on a stage; a first film forming process of forming a first carbon-based film having a first stress; a second film forming process of forming a second carbon-based film having a second stress; and a third film forming process of repeating the first film forming process and the second film forming process to form a stacked body of the first carbon-based film and the second carbon-based film, wherein the first stress and the second stress are oriented in a same direction, and the first stress and the second stress have different intensities.


Find Patent Forward Citations

Kaneko, Miyako. (2026). Substrate processing method and substrate processing apparatus (U.S. Patent No. 12772762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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