The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Nov. 20, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyohoon Byeon, Suwon-si, KR;

Seokhoon Kim, Suwon-si, KR;

Unki Kim, Suwon-si, KR;

Pankwi Park, Suwon-si, KR;

Sungkeun Lim, Suwon-si, KR;

Yuyeong Jo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 84/01 (2026.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 64/017 (2025.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 62/151 (2025.01); H10D 84/0133 (2025.01); H10D 84/0149 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01);
Abstract

An integrated circuit device includes: a rear wiring structure; an insulating substrate including fin structures disposed on the rear wiring structure and extending in a first horizontal direction; a device isolation layer disposed between the fin structures; a lower insulating layer covering the fin structures; gate structures extending in a second horizontal direction crossing the first horizontal direction; a plurality of nanosheet stacks disposed on the lower insulating layer; a first source/drain region disposed on the insulating substrate and including a body portion and a vertical extension portion, wherein the body portion is disposed between the plurality of nanosheet stacks, and the vertical extension portion passes through the lower insulating layer and through some of the fin structures; a semiconductor epitaxial structure at least partially surrounding the vertical extension portion of the first source/drain region; and a lower contact connecting the semiconductor epitaxial structure with the rear wiring structure.


Find Patent Forward Citations

Byeon, Hyohoon. (2026). Integrated circuit device including a field-effect transistor having a semiconductor epitaxial structure and method of manufacturing the same (U.S. Patent No. 12772528). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772528

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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