The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jan. 08, 2024
United Microelectronics Corp., Hsin-Chu City, TW;
Da-Jun Lin, Kaohsiung City, TW;
Bin-Siang Tsai, Changhua County, TW;
Fu-Yu Tsai, Tainan City, TW;
Tai-Cheng Hou, Tainan City, TW;
Chung-Yi Chiu, Tainan City, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Abstract
An interposer with an MIM capacitor includes a substrate. A redistribution layer is disposed on the substrate. A first copper pillar, a second copper pillar and a third copper pillar are disposed on the redistribution layer. The first copper pillar and the third copper pillar respectively electrically connect to the redistribution layer. An MIM capacitor covers and contacts the first copper pillar and the second copper pillar. A first bonding bump is disposed directly on the third copper pillar and electrically connects to the third copper pillar. A second bonding bump is disposed directly on the second copper pillar and electrically connects to the MIM capacitor.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile