logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12772373 B1

PDFFull Text
Date of Patent:
Oct. 20, 2026

Filed:

Jul. 20, 2023

Semiconductor module and method for fabricating a semiconductor module

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ramdas Rangnath Ugale, Villach, AT;

Daniel Schleißer, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Michael A Matey

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/40 (2006.01); H05K 1/18 (2026.01); H05K 3/32 (2026.01); H05K 3/325 (2026.01); H05K 7/20 (2006.01); H10W 40/60 (2026.01); H10W 40/20 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0265 (2013.01); H05K 1/18 (2013.01); H05K 3/325 (2013.01); H05K 7/209 (2013.01); H10W 40/611 (2026.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H10W 40/231 (2026.01); H10W 40/235 (2026.01); H10W 40/242 (2026.01);
Abstract

A semiconductor module includes: a printed circuit board having a first side and an opposite second side; a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, a first side of the power semiconductor packages facing the first side of the printed circuit board and an opposite second side being configured to be coupled to a heatsink; and at least one bus bar arranged over and electrically coupled to the first side of the printed circuit board. The bus bar is configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages.

Find Patent Forward Citations

Quick Actions:

Ugale, Ramdas. (2026). Semiconductor module and method for fabricating a semiconductor module (U.S. Patent No. 12772373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…