The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Oct. 26, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jaeyong Cho, San Jose, CA (US);

Rajinder Dhindsa, Pleasanton, CA (US);

Daniel Sang Byun, Campbell, CA (US);

Vladimir Knyazik, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/2007 (2013.01); H10P 72/722 (2026.01);
Abstract

Examples of a substrate support assembly are provided herein. In some examples, the substrate support assembly has a ceramic electrostatic chuck having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic electrostatic chuck includes an electrode embedded in the ceramic electrostatic chuck. The substrate support assembly has a cooling plate disposed under the second side of the ceramic electrostatic chuck, wherein the cooling plate includes an inner portion separated from an outer portion. The substrate support assembly has a bond layer coupling the ceramic electrostatic chuck to the cooling plate, wherein the bond layer is of a first material in the outer portion of the cooling plate and of a second material in the inner portion of the cooling plate, and wherein the first material has a greater thermal conductivity than that of the second material.


Find Patent Forward Citations

Quick Actions:

Cho, Jaeyong. (2026). Electrostatic chuck assembly (U.S. Patent No. 12770840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12770840

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