The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Mar. 28, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Suk Koo Hong, Suwon-si, KR;
Moo Hyun Koh, Suwon-si, KR;
Kyungoh Kim, Suwon-si, KR;
Jaemyoung Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); H10P 76/20 (2026.01);
U.S. Cl.
CPC ...
G03F 7/0042 (2013.01); H10P 76/2041 (2026.01);
Abstract
A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.
Hong, Suk. (2026). Resist composition and method of manufacturing semiconductor device using the same (U.S. Patent No. 12769203). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12769203
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile