The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Dec. 10, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dowon Kim, Singapore, SG;

Suohai Mei, Sunnyvale, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4243 (2013.01); G02B 6/4213 (2013.01); G02B 6/4214 (2013.01); G02B 6/4278 (2013.01);
Abstract

Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In one illustrative embodiment, a PIC die has one or more waveguides and one or more vertical couplers to reflect light from the waveguides through a surface of the PIC die. An optical connector interface is positioned on the surface of the PIC die with high precision. The optical connector interface includes one or more lenses to collimate light from the one or more waveguides. An optical connector is plugged into the optical connector interface. The optical connector includes one or more lenses to focus the collimated light to one or more optical fibers. As the optical connector is coupling to collimated light, it does not need to be positioned with high precision.


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Quick Actions:

Kim, Dowon. (2026). Technologies for a pluggable connector for photonic integrated circuits (U.S. Patent No. 12769071). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12769071

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