The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Aug. 23, 2022
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yasuhisa Ishihara, Annaka, JP;

Emi Akabane, Annaka, JP;

Akihiro Endo, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08J 5/18 (2006.01); C08K 3/013 (2018.01); C08L 83/04 (2006.01); C08L 91/06 (2006.01); C09D 183/06 (2006.01); H10W 40/25 (2026.01); C08G 77/20 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08J 5/18 (2013.01); C08K 3/013 (2018.01); C08L 83/04 (2013.01); C08L 91/06 (2013.01); C09D 183/06 (2013.01); H10W 40/251 (2026.01); C08G 77/20 (2013.01); C08J 2383/07 (2013.01); C08J 2491/06 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01);
Abstract

A thermally conductive film including: a silicone resin at 100 parts by mass, the silicone resin being one or more selected from: DTD, wherein D represents a siloxane unit represented by (CH)SiO, Trepresents a siloxane unit represented by (CH)SiO, Drepresents a siloxane unit represented by (CH)(CH═CH)SiO, 'm' represents an integer of 35 to 55, “n” represents an integer of 30 to 60, and “p” represents an integer of 40 to 70; or MDTD, wherein M represents (CH)SiO, L represents an integer of 10 to 30, “x” represents an integer of 15 to 35, “y” represents an integer of 40 to 60, and “q” represents an integer of 45 to 55, the silicone resin having non-flowability at 25° C.; a wax having a melting point of 20 to 60° C. at 5 to 300 parts by mass; and a thermally conductive filler at 1,000 to 6,000 parts by mass.


Find Patent Forward Citations

Ishihara, Yasuhisa. (2026). Thermally conductive film (U.S. Patent No. 12767873). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12767873

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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