The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Dec. 03, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Yuta Suzuki, Tokyo, JP;

Taro Takahashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/10 (2012.01); B24B 37/013 (2012.01); B24B 49/10 (2006.01); B24B 49/16 (2006.01); H10P 52/00 (2026.01); B24B 27/00 (2006.01); B24B 37/20 (2012.01); B24B 37/32 (2012.01); B24B 49/12 (2006.01); B24B 53/017 (2012.01); B24B 57/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/105 (2013.01); B24B 37/013 (2013.01); B24B 49/10 (2013.01); B24B 49/16 (2013.01); H10P 52/00 (2026.01); B24B 27/0023 (2013.01); B24B 37/205 (2013.01); B24B 37/32 (2013.01); B24B 49/105 (2013.01); B24B 49/12 (2013.01); B24B 53/017 (2013.01); B24B 57/02 (2013.01);
Abstract

A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.


Find Patent Forward Citations

Suzuki, Yuta. (2026). Polishing apparatus and polishing method (U.S. Patent No. 12766663). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12766663

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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