The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Aug. 08, 2024
Disco Corporation, Tokyo, JP;
Masaru Nakamura, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method includes sticking a protective tape to a front surface of a wafer, applying a laser beam to the wafer from a back surface of the wafer to thereby form trial modified layers, dividing the wafer to form a sample piece, bending the sample piece to the protective tape side to expose a section, imaging the section, and measuring the positions of the trial modified layers, thereby generating measurement data. Thereafter, appropriate positions inside the wafer at which to position a focal point of the laser beam are set based on the measurement data. The laser beam is applied to the wafer with the focal point of the laser beam positioned at the positions thus set, to thereby form modified layers, and an external force is exerted on streets to divide the wafer into individual device chips.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile