The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Mar. 31, 2023
Seriphy Technology Corporation, Hsinchu County, TW;
Tzu-Wei Chiu, Hsinchu County, TW;
Chun-Wei Chang, Taipei City, TW;
Wei-Chih Chen, Taoyuan City, TW;
Che-Yen Huang, Hsinchu County, TW;
SERIPHY TECHNOLOGY CORPORATION, Hsinchu County, TW;
Abstract
The present application discloses a semiconductor structure and a method for manufacturing a semiconductor structure. The semiconductor structure includes at least one bottom die and a plurality of top dies. The semiconductor structure further includes a redistribution layer (RDL) formed on the at least one bottom die, and a plurality of micro bumps formed on the RDL. The top dies is stacked on the bottom die with their front sides being attached to the micro bumps. The RDL allows communication between a top die and the bottom die and allows the communication between adjacent top dies. The die-stacking structure enables greater computation capability within a smaller area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile