The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jul. 13, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Shle-Ge Lee, Suwon-si, KR;

Hyunggil Baek, Suwon-si, KR;

Gyunghwan Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 10/17 (2026.01); H10B 80/00 (2023.01); H10D 1/68 (2025.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10B 80/00 (2023.02); H10D 1/68 (2025.01); H10W 74/117 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01);
Abstract

A semiconductor package includes a lower substrate that has a contact region and a non-contact region, a first upper substrate on the lower substrate, a lower device on the first upper substrate, a plurality of first solder balls between the first upper substrate and the lower substrate contact region, a plurality of capacitors between the first upper substrate and the lower substrate non-contact region, and a plurality of support blocks between the plurality of capacitors and the lower substrate non-contact region.


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Lee, Shle-Ge. (2026). Semiconductor package (U.S. Patent No. 12765424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765424

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