Method for fabricating (led) dice using laser lift-off from a substrate to a receiving plate

Abstract

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [], and forming a plurality of die sized semiconductor structures [] on the substrate []. The method also includes the steps of providing a receiving plate [] having an elastomeric polymer layer [], placing the substrate [] and the receiving plate [] in close proximity with a gap [] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [] to the semiconductor layer [] at an interface with the substrate [] to lift off the semiconductor structures [] through the gap [] onto the elastomeric polymer layer []. During the laser lift-off (LLO) process the elastomeric polymer layer [] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [] in place on the receiving plate [