The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Mar. 29, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hoyoung Kang, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01B 11/25 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0616 (2026.01); G01B 11/254 (2013.01);
Abstract

Aspects of the present disclosure provide a metrology system for measuring wafer bow of a wafer. For example, the metrology system can include a wafer support configured to position a wafer for wafer bow measurement, a first light source configured to illuminate a first side of the wafer during the wafer bow measurement, and a first pinhole mask disposed between the first light source and the wafer support. The first pinhole mask can include a plurality of first pinholes that are arranged to pass first light from the first light source and project onto the first side of the wafer a plurality of first dots that correspond to the first pinholes in the first pinhole mask. The metrology system can also include a first camera arranged to capture an image of the first dots from the first side of the wafer during the wafer bow measurement.


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Kang, Hoyoung. (2026). Wafer bow metrology system (U.S. Patent No. 12765312). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765312

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