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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12765303 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Jan. 18, 2025

Apparatus and method for wafer cleaning

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Bo Chen Chen, Hsinchu, TW;

Sheng-Wei Wu, Zhubei City, TW;

Yung-Li Tsai, Houlong Town, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Sterne, Kessler, Goldstein & Fox P.L.L.C.

Primary Examiner:

Kaj K Olsen

Assistant Examiner:

Pradhuman undefined Parihar

Int. Cl.
CPC ...
H10P 72/00 (2026.01); A46B 13/02 (2006.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/32 (2024.01); B08B 1/36 (2024.01); B08B 3/04 (2006.01); B08B 7/04 (2006.01); H10P 70/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0412 (2026.01); A46B 13/023 (2013.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/36 (2024.01); B08B 3/041 (2013.01); B08B 7/04 (2013.01); H10P 70/20 (2026.01); H10P 72/0414 (2026.01); B08B 1/32 (2024.01);
Abstract

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Find Patent Forward Citations

Chen, Bo. (2026). Apparatus and method for wafer cleaning (U.S. Patent No. 12765303). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765303

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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