The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Oct. 24, 2023
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Yoshihito Ichikawa, Matsumoto-city, JP;

Akimasa Kinoshita, Matsumoto-city, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 32/10 (2026.01); H10D 12/00 (2025.01); H10D 12/01 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01); H10D 62/53 (2025.01); H10D 62/81 (2025.01); H10D 62/832 (2025.01); H10P 30/20 (2026.01); H10P 30/22 (2026.01);
U.S. Cl.
CPC ...
H10P 32/18 (2026.01); H10D 12/031 (2025.01); H10D 30/665 (2025.01); H10D 30/668 (2025.01); H10D 62/107 (2025.01); H10D 62/109 (2025.01); H10D 62/393 (2025.01); H10D 62/53 (2025.01); H10D 62/8325 (2025.01); H10P 30/22 (2026.01); H10P 32/171 (2026.01);
Abstract

A manufacturing method of a silicon carbide semiconductor device includes: epitaxially growing a drift layer of a first conductivity-type on a silicon carbide substrate of the first conductivity-type; forming a base region of a second conductivity-type on the drift layer; forming a main region of the first conductivity-type on the drift layer so as to be in contact with the base region; forming a gate insulating film so as to be in contact with the base region and the main region; forming a gate electrode so as to be in contact with the base region and the main region with the gate insulating film interposed; and forming a lifetime killer region at a depth covering a bottom surface of the drift layer by irradiating the top surface side of the drift layer with a lifetime killer after epitaxially growing the drift layer and before forming the gate insulating film.


Find Patent Forward Citations

Ichikawa, Yoshihito. (2026). Silicon carbide semiconductor device and method of manufacturing the same (U.S. Patent No. 12765284). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765284

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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