The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

May. 10, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Sheng Kai Yeh, Taichung City, TW;

Chi-Yuan Shih, Hsinchu, TW;

Shih-Fen Huang, Hsinchu County, TW;

Wei Chun Wang, Taipei City, TW;

Shao-Da Wang, New Taipei City, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/20 (2023.01); H10N 30/082 (2023.01); H10N 30/50 (2023.01);
U.S. Cl.
CPC ...
H10N 30/2047 (2023.02); H10N 30/082 (2023.02); H10N 30/508 (2023.02);
Abstract

A semiconductor structure includes a substrate, a piezoelectric layer, and a stress structure. The substrate includes a first surface and a second surface, wherein a portion of the substrate proximal to the first surface defines a diaphragm. The piezoelectric layer is disposed over the first surface of the substrate and surrounds the diaphragm, wherein the piezoelectric layer includes a first portion and a second portion arranged along a periphery of the diaphragm from a top view. The stress structure includes a plurality of dielectric layers disposed over the piezoelectric layer and between the substrate and the piezoelectric layer, and a total thickness of a first portion of the stress structure overlapping the first portion of the piezoelectric layer is different from a total thickness of a second portion of the stress structure overlapping the second portion of the piezoelectric layer. A method for manufacturing a semiconductor structure is also provided.


Find Patent Forward Citations

Yeh, Sheng. (2026). Semiconductor structure including stress tuning structure and method for forming the same (U.S. Patent No. 12765261). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765261

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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