The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Mar. 30, 2022
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 14/20 (2026.01); C30B 25/16 (2006.01); C30B 25/18 (2006.01); C30B 29/16 (2006.01); H10D 62/40 (2025.01); H10P 14/24 (2026.01);
U.S. Cl.
CPC ...
H10D 62/40 (2025.01); C30B 25/16 (2013.01); C30B 25/18 (2013.01); C30B 29/16 (2013.01); H10P 14/24 (2026.01); H10P 14/2921 (2026.01); H10P 14/2924 (2026.01); H10P 14/2925 (2026.01); H10P 14/2926 (2026.01); H10P 14/3238 (2026.01); H10P 14/3434 (2026.01); H10P 14/3451 (2026.01);
Abstract
A laminated structure including, a ground substrate with a crystalline oxide film containing gallium oxide as a main component and a root-mean-square of a roughness on a surface of the crystalline oxide film is 0.2 μm or less. A diameter of the ground substrate is 50 mm or more and TTV of the ground substrate is 30 μm or less.
Watabe, Takenori. (2026). Laminated structure, semiconductor device and method for manufacturing laminated structure (U.S. Patent No. 12765019). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765019
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile