The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Sep. 19, 2023
Winbond Electronics Corp., Taichung City, TW;
Chang-Hung Lin, Chiayi City, TW;
WINBOND ELECTRONICS CORP., Taichung City, TW;
Abstract
A method for forming a semiconductor structure is provided. The method includes: forming a trench in a semiconductor substrate; forming a gate lining layer along a lower portion of the trench; filling a gate electrode layer over the gate lining layer in the lower portion of the trench; forming a first sacrificial layer along a sidewall of an upper portion of the trench; forming a barrier layer along a sidewall of the first sacrificial layer and over a top surface of the gate electrode layer; removing a first portion of the barrier layer along the sidewall of the first sacrificial layer, thereby leaving a second portion of the barrier layer over the top surface of the gate electrode layer; forming a semiconductor layer over the second portion of the barrier layer; removing the first sacrificial layer; and forming a capping layer over the semiconductor layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile