The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Dec. 20, 2023
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Lu Wang, Chandler, AZ (US);

Xin Fu, Chandler, AZ (US);

Lu Li, Gilbert, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H10W 40/22 (2026.01); H10W 44/20 (2026.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H10W 40/22 (2026.01); H10W 44/20 (2026.01); H03F 2200/423 (2013.01); H03F 2200/451 (2013.01); H10W 44/206 (2026.01); H10W 44/234 (2026.01);
Abstract

A packaged semiconductor device includes a substrate, an interface for signal communication with an external power splitter, and a first and second stages of a multiple-stage amplifier. The interface includes first, second, and third leads coupled to the substrate. The first amplifier stage includes a first amplifier die with a first input, a first output, and a first power transistor that functions as a driver amplifier. The second amplifier stage includes first and second amplifier paths. The first amplifier path has a second amplifier die with a second input, a second output, and a second transistor that functions as a first final stage amplifier. The second amplifier path has a third amplifier die with a third input, a third output, and a third transistor that functions as a second final stage amplifier. The first output, second input, and third input are coupled to the first, second, and third leads, respectively.


Find Patent Forward Citations

Wang, Lu. (2026). Multiple-stage multiple-path power amplifier with in-package amplifier dies and external inter-stage power splitter (U.S. Patent No. 12763730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12763730

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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