The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Feb. 18, 2022
Applicant:

Jx Advanced Metals Corporation, Tokyo, JP;

Inventors:

Reina Tsuchihashi, Ibaraki, JP;

Hironori Orikasa, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/054 (2022.01); B22F 9/04 (2006.01); B22F 9/24 (2006.01);
U.S. Cl.
CPC ...
B22F 1/054 (2022.01); B22F 9/04 (2013.01); B22F 9/24 (2013.01); B22F 2301/10 (2013.01); B22F 2304/052 (2013.01); B22F 2998/10 (2013.01);
Abstract

A copper powder containing copper particles, wherein the copper powder has a packed bulk density of 1.30 g/cmto 2.96 g/cm, and wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies D/D50≥0.060.


Find Patent Forward Citations

Tsuchihashi, Reina. (2026). Copper powder (U.S. Patent No. 12759040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12759040

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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