The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 12, 2023
Seriphy Technology Corporation, Hsinchu County, TW;
Tzu-Wei Chiu, Hsinchu County, TW;
Chun-Wei Chang, Taipei City, TW;
Wei-Chih Chen, Taoyuan City, TW;
Che-Yen Huang, Hsinchu County, TW;
SERIPHY TECHNOLOGY CORPORATION, Hsinchu County, TW;
Abstract
The present application discloses a semiconductor package and a method for manufacturing the semiconductor package. The semiconductor package includes a first dielectric layer, a first redistribution layer (RDL) disposed on a first surface of the first dielectric layer, a first bonding layer disposed on the first RDL, a plurality of bottom dies attached to the first bonding layer, a second dielectric layer filling gaps between the bottom dies, a plurality of conductive pillars disposed in the second dielectric layer without contacting the bottom dies, a second RDL disposed on the second dielectric layer and the bottom dies, a second bonding layer disposed on the second RDL, a plurality of top dies attached to the second bonding layer, a third dielectric layer filling gaps between the top dies, and a plurality of solder bumps disposed on a second surface of the first dielectric layer.