The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jun. 29, 2023
Enkris Semiconductor, Inc., Suzhou, CN;
Kai Cheng, Suzhou, CN;
ENKRIS SEMICONDUCTOR, INC., Suzhou, CN;
Abstract
Disclosed are a composite substrate, a manufacturing method thereof and a semiconductor device. The composite substrate includes a first substrate, a bonding layer, and a second substrate which are stacked sequentially, where the first substrate comprises a plurality of protruding structures disposed on a side close to the second substrate, and a groove formed between at least two protruding structures of the plurality of protruding structures. The composite substrate provided by the present disclosure, by setting a bonding layer, a bond strength between the first substrate and the second substrate may be improved, and a mechanical strength of the composite substrate is enhanced. By setting the groove, a stress transmitted from the second substrate to the first substrate may be attenuated, so as to improve the mechanical strength of the composite substrate and avoid a plastic deformation in a subsequent epitaxial process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile