The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Nov. 28, 2023
Applicant:
United Microelectronics Corp., Hsin-Chu City, TW;
Inventors:
Chiao-Yi Teng, Taichung City, TW;
Kun-Ju Li, Tainan City, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 46/00 (2026.01); H10W 20/00 (2026.01); H10W 70/60 (2026.01); H10W 70/63 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10W 46/00 (2026.01); H10W 20/023 (2026.01); H10W 70/611 (2026.01); H10W 70/635 (2026.01); H10W 90/00 (2026.01); H10W 46/301 (2026.01); H10W 72/019 (2026.01); H10W 72/01953 (2026.01); H10W 72/9445 (2026.01); H10W 72/957 (2026.01); H10W 90/297 (2026.01);
Abstract
The invention provides a semiconductor structure, which comprises a first chip and a second chip attached to each other, wherein the first chip comprises a quantum dot pattern, and the second chip comprises a through silicon via (TSV), wherein the quantum dot pattern and the through silicon via are aligned with each other.
Teng, Chiao-Yi. (2026). Semiconductor structure and alignment method thereof (U.S. Patent No. 12757744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757744
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile