The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Sep. 13, 2022
International Business Machines Corporation, Armonk, NY (US);
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Brent A. Anderson, Jericho, VT (US);
Ruilong Xie, Niskayuna, NY (US);
Reinaldo Vega, Mahopac, NY (US);
Albert M. Chu, Nashua, NH (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A skip-level via structure is provided that electrically connects a third level of interconnect wiring to a first level of interconnect wiring or a fourth level of interconnect wiring to a first level of interconnect wiring. In the first instance, the skip-level via structure enables connection even when the first level of interconnect wiring and the third level of interconnect wiring do not line up. In the second instance, the skip-level via structure enables a low resistance connection of the fourth level of interconnect wiring to the first level of interconnect wiring due to increased contact area.