The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jul. 12, 2024
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yuma Terashima, Nagano, JP;

Shun Takagi, Nagano, JP;

Keita Sato, Nagano, JP;

Yohei Yamada, Nagano, JP;

Yuta Naito, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/72 (2026.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H10P 72/722 (2026.01); H01J 37/32724 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01);
Abstract

A substrate fixing device includes a base plate, an adhesive layer provided on the base plate, a heat insulating layer provided on the adhesive layer, and an electrostatic chuck provided on the heat insulating layer. The electrostatic chuck includes a base and an electrostatic electrode provided in the base, and the heat insulating layer has a lower thermal conductivity than the base and the adhesive layer.


Find Patent Forward Citations

Terashima, Yuma. (2026). Substrate fixing device (U.S. Patent No. 12757684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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