Composite substrate and manufacturing method therefor, and semiconductor device structure

Abstract

Disclosed are a composite substrate and a manufacturing method therefor, and a semiconductor device structure. The composite substrate includes a substrate and a plurality of strengthening structures, where the plurality of strengthening structures are disposed within the substrate at intervals, and a material of the plurality of strengthening structures is a poly-crystal material or an amorphous material. The composite substrate provided by the present disclosure may withstand stress, constrain deformation, and prevent extension of a dislocation by providing the strengthening structures inside the substrate, thereby enhancing mechanical strength of the composite substrate. By filling the poly-crystal material or the amorphous material in the single-crystal substrate, the extension of the dislocation in single-crystal substrate may be prevented, so that the strength of substrate may be improved, and probability of fragmentation of the composite substrate may be reduced.