The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 18, 2023
Fuji Electric Co., Ltd., Kanagawa, JP;
Tohru Shirakawa, Matsumoto-city, JP;
Yoshiharu Kato, Matsumoto-city, JP;
Yuuki Oda, Matsumoto-city, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
Provided is a semiconductor device including: a plurality of trench portions, one or more mesa portions which are sandwiched between two trench portions; an upper-surface electrode which does not contain a metal having a higher melting point than a material of the semiconductor substrate; and a barrier metal which contains the metal having the higher melting point than the material of the semiconductor substrate, and including: a first region where the barrier metal is not provided between the trench portion and the upper-surface electrode and where the barrier metal is provided between the mesa portion in contact with the trench portion not provided with the barrier metal and the upper-surface electrode; and a second region where the barrier metal is provided between the trench portion and the upper-surface electrode.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile