The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jan. 24, 2023
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Ferdinando Iucolano, Gravina di Catania, IT;

Filippo Giannazzo, Catania, IT;

Giuseppe Greco, Misterbianco, IT;

Fabrizio Roccaforte, Mascalucia, IT;

Assignee:

STMICROELECTRONICS S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/47 (2025.01); H10D 30/01 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 64/27 (2025.01); H10P 14/20 (2026.01); H10P 14/24 (2026.01); H10P 14/40 (2026.01); H10P 50/00 (2026.01); H10P 50/24 (2026.01); H10P 76/20 (2026.01);
U.S. Cl.
CPC ...
H10D 30/475 (2025.01); H10D 30/015 (2025.01); H10D 64/01 (2025.01); H10D 64/258 (2025.01); H10D 64/411 (2025.01); H10P 14/24 (2026.01); H10P 14/3434 (2026.01); H10P 14/40 (2026.01); H10P 14/412 (2026.01); H10P 50/242 (2026.01); H10P 50/692 (2026.01); H10P 50/695 (2026.01); H10P 76/202 (2026.01);
Abstract

An enhancement mode high electron-mobility transistor (HEMT) device includes a semiconductor body having a top surface and including a heterostructure configured to generate a two-dimensional electron gas, 2DEG. The HEMT device includes a gate structure which extends on the top surface of the semiconductor body, is biasable to electrically control the 2DEG and includes a functional layer and a gate contact in direct physical and electrical contact with each other. The gate contact is of conductive material and the functional layer is of two-dimensional semiconductor material and includes a first doped portion with P-type electrical conductivity, which extends on the top surface of the semiconductor body and is interposed between the semiconductor body and the gate contact along a first axis.


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