The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Oct. 02, 2023
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Zar Lwin Zin, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Eng Huat Toh, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 20/25 (2023.01);
U.S. Cl.
CPC ...
H10B 20/25 (2023.02);
Abstract

The embodiments herein relate to antifuses capable of forming localized conductive links and methods of forming the same. An antifuse is provided. The antifuse includes a substrate, a dielectric liner, and an electrode. The substrate includes a conductor layer, and a trench is in the conductor layer. The trench includes a first conductor surface and a second conductor surface. The dielectric liner is in the trench. The electrode is on the dielectric liner in the trench, and the electrode includes a first electrode surface and a second electrode surface converging to the first electrode surface.


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