The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Feb. 14, 2023
Chipbond Technology Corporation, Hsinchu, TW;
Yi-Hui Chen, Hsinchu City, TW;
Yi-Hua Huang, Hsinchu City, TW;
Yen-Ping Huang, Hsinchu City, TW;
Shih-Chieh Chang, Chiayi County, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
In a tape processing method, a tape including substrate units is processed by a die device. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader which is attached onto the carrier by the adhesive. The die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile