The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
May. 30, 2024
Chipbond Technology Corporation, Hsinchu, TW;
Shih-Chuan Lee, Kaohsiung City, TW;
Ching-Chi Chan, Taichung City, TW;
Tzu-Min Wu, Kaohsiung City, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A circuit board includes a substrate, circuit lines and a protective layer. The circuit lines are arranged on the substrate, and each includes a first conductive section, a second conductive section and a third conductive section, the second conductive section is located between the first and third conductive sections. The first and third conductive sections are covered by the protective layer, and the second conductive portion and an outer lead of the first conductive section are not covered by the protective layer. The protective layer covering the third conductive section is provided to protect the second conductive section and the outer lead from scratch or compression.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile