The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Apr. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Hiroki Tanaka, Gilbert, AZ (US);

Bai Nie, Chandler, AZ (US);

Kristof Darmawikarta, Chandler, AZ (US);

Hari Mahalingam, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/122 (2006.01); G02B 6/12 (2006.01); G02B 6/30 (2006.01);
U.S. Cl.
CPC ...
G02B 6/122 (2013.01); G02B 6/30 (2013.01); G02B 2006/12038 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/1215 (2013.01);
Abstract

Techniques for signal amplification for a photonic integrated circuit (PIC) die are disclosed. In the illustrative embodiment, an optical fiber is coupled to an input signal waveguide in a glass interposer, and an input signal waveguide of a PIC die is coupled to the input signal waveguide of the glass interposer. In order to compensate for any coupling losses, the input signal waveguide of the glass interposer is active, amplifying an input signal. Light in a pump waveguide near the input signal waveguide pumps ions in the input signal waveguide into a population inversion, allowing them to amplify the input signal.


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