The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Oct. 04, 2021
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Toshio Hasegawa, Nirasaki City, JP;
Katsutoshi Ishii, Nirasaki City, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); C23C 16/40 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
C23C 16/045 (2013.01); C23C 16/403 (2013.01); C23C 16/56 (2013.01);
Abstract
A filling method according to one aspect of the present disclosure is a method of filling a recess formed in a surface of a substrate with a metal oxide film. The method includes forming the metal oxide film by supplying a metallic raw material gas and an oxidant to the recess, and etching a part of the metal oxide film by supplying an etching gas including at least one selected from a group including SOCland (COCl)to the metal oxide film.